We are active in the field of die bonders and rework machines from R&D applications to products where precision and flexibility are required.
Sale of machines
- Die-Bonder: /Finetech: flexible, high-precision / Finetech from laboratory to automatio
- Rework machines: Advanced – from BGA to 01005 ; Finetech / Martin-SMT
Surfast Machines: Surface Treatment Decoating, Polishing, Cleaning
Die-bond-services
- Feasibility studies/error analyses
- Application test
- Process development
Rework services
- Feasibility studies/error analys
- Application test
- Process development
Machine services
- Feasibility studies/error analyses
- Application test
- Process development
Application overview
- MEMS / MOEMS packaging, Micro Optic Assembly, Laser Diode / Laser Bar Bonding, Flip-Chip (face down, face up) Chip on Glass, Chip on Flex
Die-Bond Processes
- Soldering, bonding (ACP, ACF), ultrasonic, thermosonic, eutectic bonding
